Solar >> Logomatic GmbH

Groove Grinding

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Detailed Specs

The machine is designed to regrind OD and regroove the wire guides from e. g. Logomatic (Diamond Multi Wire Saw), Linton, HCT, Meyer+Burger, Themis, NTC-Japan, Toyo and Takatory and all other slurry or diamond wire saws, which need refurbishing of wire guide rolls. This machine can grind OD sizes from 2 – 13 inches (50-350 mm), with high precision pitch for a length from 100 – 1000 mm.