Semiconductor & Solar >> ULTECH Co. Ltd, South Korea

Rapid Thermal Annealing System (RTA/RTP)

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      Detailed Specs

      ULTECH’s Rapid Thermal Annealing (RTA) system features include;

      – Substrate size & load capacity : 4inch wafer – 1 wafer/batch

      – Temperature range : RT~1,000 ℃

      – Substrate holder : Quartz (pin)

      – Rotary pump

      – Manual angle valve

      – MFC: O2(1slm), N2(1slm)

      – Manual control (switch panel)

      RTA offered by ULTECH includes: Single Side heating and Double side heating