Semiconductor & Solar >> Logomatic GmbH

Multi-Crystalline Silicon Ingot Top & bottom grinding

I am interested in this product

Your Name (required)

Your Email (required)

Contact Number

Product Name

Close Form

I am interested in this product

Your Name (required)

Your Email (required)

Contact Number

Product Name

Close Form

Detailed Specs

Advantages:
– High throughput with low costs
– Significant material waste reduction
– Less risk of wire breakage for squaring
– Flat surfaces for further processing
– Save up to 3% costs of wafer manufacturing
– Mechanical clamping
– Automatic grinding process