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Silicon Ingot Ductile polish-grinding & chamfering

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Detailed Specs

Silicon Ingot Ductile polish-grinding & chamfering

MPS 3-134 High precision surface and chamfer grinding machine to finish mono- and multi-crystalline and UMG silicon bricks for solar wafer.
– Ductile polish-grinding method
– 50% Si wafer breakage reduction
– Prepared for in-line-system (robot-loading)
– Twin-spindle ® grinding concept for rough and fine / finish grinding of the surfaces
– Second grinding spindle for simultaneously chamfering the edges of the brick
– Grinding of the surfaces and the edges in the same clamping position (no rechucking / handling in between)
– Automatic handling (loading, unloading, turning) of the brick
– Automatic grinding progress with integrated measuringWAFER BREAKAGE

REDUCTION

– Ductile polish grinding for solar bricks helps to reduce wafer breakage significantly