Electronics Assembly & Packaging >> DISCO Hi-Tech, Japan

DAS8920 Surface Planer

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    Semi-automatic surface planer for Φ8-inch wafers
    Φ200 mm
    1 axis, 1 chuck table
    Planarization

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      Ultrahigh-precision planarization technology using a diamond bit
      The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness

      Processing example
      Bump planarization
      The planarization process reduces Au bump height variation and stress (temperature and load) when bonding Au-Au interfaces for use in next generation SiP solutions.

      LED phosphor resin planarization
      Variations in resin thickness of the LED emission unit is the cause of color irregularities. Planarization of the resin and bumps with high accuracy using a diamond bit can contribute towards the stabilization of LED color emissions.