We offer Semiconductor Instrumentation and manufacturing process technologies for the entire process, wafer to packaging and characterization of Semiconductor devices. We have built a network of suppliers, leaders in their fields, all providing unique technologies for a broad spectrum of applications in Front End, Back End, Test and Packaging.
We offer “best in class” products for electronics and semiconductor device assembly and packaging equipment from world leading manufacturers, our solutions include,
Ø Leaded Package
Ø Leadless Package and
Ø Wafer level packaging
and some of the products we offer Auto/manual mold, Laser Mark, Trim, Form & Singulation, 3D Vision Inspection tool, Laser Ablation, Sawing Placement, Laser Cutting/Form Grinding, Pick and Place, Wafer Ball Mount, Automatic Dicing SAW, Laser SAW, Die Separator, Grinder, Polisher & Surface Planer, Wire Bonder, Flip-Chip Bonder, Die Attach etc
We at Tesscorn offer a range of Surface Mounting Assembly and Packaging equipment from world renowned manufactures. We have trained and dedicated technical team offering installation, warranty and post warranty maintenance support to all our customers. Our Range of product offerings include PCB – Inner layer, outer layer, solder mask UV-LED Exposure Systems, Direct Imaging Systems. SMT – Pick and Place Machines, Soldering Machines, Solder Paste Printer Series, Inspection Machines, Conformal Coating Machines, BGA Rework Station series, Automatic Stencil Printer, UV Curing Oven, IR Reflow Oven