Electronics Assembly & Packaging >> DISCO Hi-Tech, Japan

DGP8761 Fully Automatic Grinder/Polisher

I am interested in this product

    Your Name (required)

    Your Email (required)

    Contact Number

    Product Name

    Close Form

    I am interested in this product

      Your Name (required)

      Your Email (required)

      Contact Number

      Product Name

      Close Form

      Downloads

      Detailed Specs

      Realizes improvements in process stability and higher throughput
      The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding. This contributes to a shorter thin wafer processing time (compared to the DGP8760). In addition, an optimized handling layout shortens the cycle time (not including processing time).

      Various Z3 spindle configurations
      The following Z3 spindle configurations for thin wafer processing can be selected:

      Stress relief

      Dry polishing – an environmentally friendly process without chemicals or water
      CMP (optional)

      Super fine grinding (optional)

      Poligrind
      UltraPoligrind

      Realizing configurations which provide a gettering effect on the Z3-axis
      *Gettering: a process which forms a minute destructive layer (gettering sites) inside the silicon wafer. Impurities, such as heavy metals, present in the wafer are captured at these gettering sites.

      Gettering DP

      This is a solution which realizes high die strength and maintains the gettering effect by using DISCO’s unique dry polishing.

      Grinding wheel “UltraPoligrind”

      The newly developed UltraPoligrind wheel, which uses micro-abrasives, can process thin wafers without chemicals. The wheel can achieve high wafer strength which cannot be obtained with traditional grinding wheels, while maintaining the grinding gettering effect (Extrinsic Gettering).

      System expandability
      By integrating the DGP8761 with a multi-wafer mounter, DFM2800, it is possible to support the attachment of DAF (Die Attach Film) for thin wafers. It can also be used in an inline configuration with DISCO’s DBG (Dicing Before Grinding) process.

      DISCO 8000 Series compatibility
      The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method and GUI (Graphical User Interface) are based on proven 8000 Series technology.