Semiconductor & Solar >> Denton Vacuum LLC, USA

Electron Beam and Thermal Evaporation

I am interested in this product

Your Name (required)

Your Email (required)

Contact Number

Product Name

Close Form

I am interested in this product

Your Name (required)

Your Email (required)

Contact Number

Product Name

Close Form

Downloads

Detailed Specs

Denton Vacuum’s e-beam evaporation systems are delivered with programmable sweep controllers to provide optimal heating of the evaporation materials and minimized contamination from a crucible. Multi-pocket e-beam sources can be provided to sequentially evaporate different evaporation materials without breaking vacuum for multi-layer film designs. Systems are configured with thin film deposition controllers for automated single and multiple-layer process control. Real-time optical monitoring and control hardware and software can be fully integrated into a system to allow for automated process control for critical optical coating applications.

E-beam evaporation is controllable, repeatable and compatible with the use of an ion assist source to enhance the desired thin film performance characteristics. Denton has developed two systems for e-beam evaporation applications, one offering a versatile configuration for R&D and pilot production, the other targeting high-volume production with application-specific configurations. We have over 50 years of experience in delivering turn-key process solutions for metallization, lift-off, and precision optical coatings. The e-beam solutions below provide many options to meet your application’s requirements.

INTEGRITY:
The Integrity is configured for demanding optical, semiconductor and compound semiconductor applications. A temperature management system supports a fluid-cooled substrate stage, which enables for small grains and textured films.

EXPLORER:
The Explorer provides the ultimate in flexibility, offering a range of configurations and deposition technologies, including e-beam evaporation, resistance evaporation, sputtering, and ion-assisted deposition.