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HF Vapor Release Etch

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Detailed Specs

Dry HF vapor etch processing for removing sacrificial oxide layers. SPTS offers the broadest range of dry HF vapor release products, from lab systems for research and development to multi-chambered cluster tools for high volume production. The industry leading Primaxx® HF vapor etch release technology is used to remove sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices.
Our proprietary dry process avoids stiction of released moving parts and damage to delicate structures – common issues with conventional wet processing technology.
Combining anhydrous HF vapor and alcohol vapor at reduced pressure and elevated temperature provides a wide, stable process window that can address different oxide compositions and thicknesses, while maintaining high selectivity to other common materials found in MEMS designs including exposed aluminum/alloy features such as mirrors and bondpads.