Semiconductor & Solar >> Denton Vacuum LLC, USA

Magnetron Sputtering

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Detailed Specs

Denton offers flexible sputtering platforms that can be configured with multiple magnetron sources. Our systems are configurable to support a variety of sputtering approaches. Conductive target materials, such as metals, are typically sputtered with DC power supplies. Magnetic materials, such as nickel or iron, are DC sputtered with enhanced magnet packs. Insulating target materials are reactively sputtered with either RF or Pulsed DC power delivery systems. A fully integrated Plasma Emission Monitor (PEM) system was developed to enable high-rate, controlled reactive sputtering. Denton has ongoing internal R&D programs to help advance the state-of-the art in both metallic and reactive sputtering.

EXPLORER:
The Explorer provides the ultimate in flexibility, offering a range of configurations and deposition technologies, including e-beam evaporation, resistance evaporation, sputtering, and ion-assisted deposition.

PHOENIX:
The Phoenix Magnetron Sputtering system offers high throughput for large volume production, and supports both planar and 3D component processing. This system can accommodate RF, AC, DC and pulsed DC sputtering processes.

DISCOVERY:
The Discovery Magnetron Sputtering system offers versatility and high-volume production capability. The system can accommodate up to 6 cathodes with triaxis adjustment.

DESKTOP PRO:
The Desktop Pro is a compact high-vacuum sputtering system that offers superior productivity using less than 36 inches (914 mm) of desk space. Truly versatile, the Desktop Pro can provide co-sputtering and the deposition of magnetic and/or dielectric materials.