Semiconductor & Solar >> SPTS Technologies

Metal Deposition

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Detailed Specs

Sigma® Deposition Systems
The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD
Metal Deposition Technologies
• Standard PVD – conventional sputter modules for low topography features
• Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features
• C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier
Advantages of SPTS PVD
• Single wafer processing, improves yields and on-wafer performance, when compared to batch processing.
• Planar target with full face erosion
o avoids re-sputtering, reduces particle contamination
o improves target life
• Rapid target change (<5mins), with common magnetron increases uptime
• Reliable handling of fragile, thinned or bowed wafers
• “”Super Uniformity”” option available for specialist applications
• Multi-wafer degas to increase throughput for long (low temp) degas applications
• Common software for 200mm and 300mm systems – ease of use