Semiconductor >> Aurion Anlagentechnik GmbH, Germany

Plasma cleaning and Ashing System

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Detailed Specs

Aurion’s Plasma Cleaning and Ashing systems use either microwave or RF excitation. Microwave plasma is ideal for most resist removal in modern device fabrication, since it produces a very high concentration of chemically active species along with low ion bombardment energy, guaranteeing fast ash rate and a damage-free plasma cleaning. Microwave plasma systems are suitable for various substrate technologies like Si, III/V-compounds, quartz, ceramic, lithium niobate, copper interconnect devices etc. The inherently isotropic plasma etch characteristic is an advantage for sacrificial layer etch and SU-8 removal in MEMS fabrication.