Semiconductor & Solar >> SPTS Technologies

Plasma Enhanced Chemical Vapor Deposition (PECVD)

I am interested in this product

Your Name (required)

Your Email (required)

Contact Number

Product Name

Close Form

I am interested in this product

Your Name (required)

Your Email (required)

Contact Number

Product Name

Close Form

Detailed Specs

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process which uses the energy within the plasma to induce reactions at the wafer surface that would otherwise require higher temperatures associated with conventional CVD. Energetic ion bombardment during deposition can also improve the film’s electrical and mechanical properties.
Delta Deposition Systems
SPTS’s Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductor, and advanced packaging industries, particularly in applications where a low processing temperature is required.
Key Benefits
• Wafer sizes from 75mm to 300mm
• Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity
• Up to 10 gas lines and optional on-board liquid delivery system
• Mixed frequency plasma capability for stress tuning
• Active platen cooling for critical, low temperature [<175°C] packaging applications
• Single and multi-wafer preheat chamber options for de-gassing sensitive substrates