Semiconductor >> EV Group, Austria

Resist Processing System/Spin & Spray Coating, developing System

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Detailed Specs

EVG resist processing systems/Spin and Spray coating systems provide a high degree of versatility. The resist processing systems/Spin and Spray coating systems can process wafers from 2″ to 300mm diameter, rectangle, square or even irregular shaped substrates. Also, the resist processing systems/Spin and Spray coating systems can handle more than one substrate size, up to 200mm, with no or a very short tooling time. Additional features such as wafer edge handling or thin wafer handling are regularly provided for customers. EVG also offers systems for larger substrate sizes, e.g. for the field of display manufacturing. These functions provide for a wide range of applications in MEMS/MOEMS and semiconductor markets. As with all EVG processing systems, the equipment can be configured for high volume production or R&D environments.