Semiconductor >> EV Group, Austria

Thermal Nano Imprint Lithography/Hot Embossing System

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Detailed Specs

The Hot Embossing/Thermal Nano Imprint Lithography systems are configured with a universal embossing chamber, high-vacuum and high-contact force capabilities and manages the whole range of polymers suitable for hot embossing. Together with high-aspect ratio embossing and multiple de-embossing options many processes for high quality pattern transfer and nm resolution are offered. Also Using rolls, instead of plates, the Roll to Roll system enables continuous moulding with significant advantages in operational speed and device throughput. The Hot Embossing/Thermal Nano Imprint Lithography is especially well suited for structuring fine features in the sub-micron to nanometer scale. Furthermore, the technology implies advantages over mainstream reshaping technologies such as injection moulding if structured thin films are required. The Roll to Roll’s innovative design provides excellent temperature and pressure uniformity for micro- and nanoscale patterning on a broad range of materials. In addition, the R2R enables roll-to-roll patterning on exotic materials that are not available on large rolls. The Hot Embossing/Thermal Nano Imprint Lithography is designed to deliver the highest flexibility for R&D applications with a clear vision for automated mass manufacturing of flexible devices.