Electronics Assembly & Packaging >> Kulicke & Soffa, Singapore

Wedge Bond Asterion

I am interested in this product

    Your Name (required)

    Your Email (required)

    Contact Number

    Product Name

    Close Form

    I am interested in this product

      Your Name (required)

      Your Email (required)

      Contact Number

      Product Name

      Close Form

      Downloads

      Detailed Specs

      The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. Powerful new software features, like the graphical editor, make programming complex devices easier, and multisegmented bonding includes flexible tools to deliver an optimized bonding process.

      Key Advantages:

      Large bondable area (300 x 300 mm)
      Multi-lane capability
      Consistent process results
      Low cost-of-ownership with reduced preventive maintenance